KFR 256G DDR4 3200 DIMM K8 Blk
Introduction
Enhance AMD- or Intel-based systems with ultra-fast Kingston FURY™ Renegade DDR4 memory, ensuring you maintain peak performance levels. Combine speeds of up to 5333MT/s[*]* with quick CL16-CL20 timings to increase frame rate, keep streams smooth and edit all your content in a flash. The bold, two-tone black heat spreader with black PCB not only adds a touch of style but also manages heat while tackling heavy workloads. Available in single module capacities of 8GB–32GB and kits of 2, 4 and 8 with capacities of 16GB–256GB. Kingston FURY Renegade DDR4 is Ready for AMD Ryzen, Intel® XMP Certified and XMP Ready. You’re ready to go with profiles that are optimised for AMD and Intel’s latest chipsets.
High speeds plus low latencies for extreme performance
With speeds of up to 5333MT/s* paired with quick CL16–CL20 timings to help your AMD- or Intel-based system power through games, video editing and broadcasting, [Kingston FURY Renegade DDR4] is the prime choice to meet demands.
Intel® XMP Certified or Ready
Intel Extreme Memory Profile technology makes it possible to overclock with ease. Select one of the built-in, hand-tuned profiles in your BIOS to get the benefits of overclocking without having to manually adjust the memory timings yourself.
Ready for AMD Ryzen
Get memory that’s Ready for Ryzen and will seamlessly integrate with your AMD-based system. A reliable, compatible performance boost for your build.
Intense black aluminium heat spreader
The two-tone black aluminium heat spreader and black PCB keep your rig running and looking sharp.
Specifications
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 129.5 mm |
| Package depth | 73.7 mm |
| Package height | 171.4 mm |
| Width | 8.29 mm |
| Depth | 133.3 mm |
| Height | 42 mm |
| Weight | 41.43 g |
| Package weight | 570.54 g |
| Packaging data | |
| Package width | 129.5 mm |
| Package depth | 73.7 mm |
| Package height | 171.4 mm |
| Package weight | 570.54 g |
| Logistics data | |
| Master (outer) case width | 181.6 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 146.1 mm |
| Master (outer) case gross weight | 1.9 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
