EU Product - Thermal Pad TP-4 100*100 mm 1.0mm - Cooling Accessory

Introduction

High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.

Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.

Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.

Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.

Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.

Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.

Versatile Applications
Ideal for RAM, chipsets, GPUs, consoles, laptops, and many other electronic components. Flexible, vibration-dampening, and easy to cut.

Specifications

Features
Type	Thermal pad
Density	3.4 g/cm³
Operating temperature (T-T)	-40 - 200 °C
Product colour	Grey
Technical details
Warranty period	6 year(s)
Compliance certificates	UL, RoHS
Density	3.4 g/cm³
Operating temperature (T-T)	-40 - 200 °C
Weight & dimensions
Width	100 mm
Depth	100 mm
Height	1 mm
Package width	115 mm
Package depth	120 mm
Package height	2 mm
Package weight	45 g
Packaging data
Package width	115 mm
Package depth	120 mm
Package height	2 mm
Package weight	45 g
Quantity per pack	1 pc(s)
Operational conditions
Operating temperature (T-T)	-40 - 200 °C
Colour
Product colour	Grey
Logistics data
Country of origin	China
Quantity per pack	1 pc(s)