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Part No:KF560C30BWK2-64
Stock:16 In Stock
EAN Code:0740617343236
Up to 6800MT/s
Kingston FURY™ Beast DDR5 memory provides superb speed, capacity and reliability for next-gen gaming platforms. Level up your machine’s performance with enhanced features like on-die ECC for better stability and dual 32-bit subchannels to boost efficiency. Kingston FURY Beast DDR5 offers overclock specs for Intel® XMP 3.0 and AMD EXPO™ with customisable profiles for speeds and timings to help you wring the most from your gaming experience, livestream at 4K+ or push animation and 3D rendering projects.
Kingston FURY™ Beast DDR5 memory brings the latest, cutting-edge technology for next-gen gaming platforms. Taking speed, capacity and reliability even further, DDR5 arrives with an arsenal of enhanced features, like on-die ECC (ODECC) for improved stability at extreme speeds, dual 32-bit subchannels for increased efficiency and an on-module power management integrated circuit (PMIC) to provide juice where it’s needed most.
Superior speed advancements, with double the banks from 16 to 32 and double the burst length from 8 to 16, take DDR5 memory, your gaming experience and your overall system applications to the next level of performance.
Whether you’re pushing the limits in your gaming with the most extreme settings, live streaming at 4K+ or pushing large animation and 3D rendering, Kingston FURY Beast DDR5 memory is the level-up needed, while seamlessly bridging style and unleashing performance.
With options featuring Intel XMP 3.0 or AMD EXPO, two new DDR5 overclock specs that include customisable profiles for speeds and timings, Kingston FURY Beast DDR5 has your compatible overclock solutions covered."
Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain the ultimate performance while you push the limits!
Increased efficiency
Boosted by double the banks and burst length and two independent 32-bit subchannels, DDR5’s exceptional handling of data shines with the latest games, programs and demanding applications.
Intel® XMP 3.0 certified
Advanced pre-optimised timings, speed and voltage for overclocking performance and save new user-customisable profiles using a programmable PMIC.
AMD EXPO certified
AMD EXPO (Extended Profiles for Overclocking) Certified modules include Intel XMP 3.0 profiles, enabling compatibility with the platform of your choice.
Qualified by the world’s leading motherboard manufacturers*
Tested and approved so you can build and upgrade with confidence on your preferred motherboard.
Low-profile heat spreader
Newly designed heat spreaders in black or white combine bold styling and outstanding cooling functionality.
Power | |
---|---|
Memory voltage | 1.35 V |
Design | |
Backlight | No |
Product colour | White |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | White |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 30 |
Memory voltage | 1.35 V |
Lead plating | Gold |
SPD profile | Yes |
ECC | No |
Internal memory type | DDR5 |
Features | |
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Backlight | No |
Product colour | White |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 30 |
Memory voltage | 1.35 V |
Lead plating | Gold |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
ECC | No |
Internal memory type | DDR5 |
JEDEC standard | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions | |
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 6.62 mm |
Depth | 133.3 mm |
Height | 34.9 mm |
Weight | 69.18 g |
Package weight | 101.72 g |
Packaging data | |
Package width | 95.2 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 101.72 g |
Logistics data | |
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.1 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 2.75 kg |
Products per master (outer) case | 25 pc(s) |
Other features | |
Country of origin | China, Taiwan |
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